H1B Report
Side-by-side comparison

Microsoft Corporation vs Qualcomm Incorporated

A direct H-1B sponsorship comparison built from the same DOL Labor Condition Application data that drives every page on H1B Report. Total filings, outcome rates, top occupations and yearly demand side-by-side.

Entity A
Microsoft Corporation
WARank #5FEIN 91-1144442
Entity B
Qualcomm Incorporated
CARank #74FEIN 95-3685934

Key metrics

All percentages are share of total LCAs filed by each sponsor.

MetricMicrosoft CorporationQualcomm Incorporated
Total filings72,9125,426
Certified %94.30%67.31%
Denied %0.15%1.11%
Withdrawn %0.69%4.05%
Cert-withdrawn %4.85%27.53%
Rank#5#74
Active yearsFY2010–FY2026FY2010–FY2026
Worksite stateWACA

Outcomes — Microsoft Corporation

DOL case-status mix.

Outcome breakdown: Certified 94.3%, Cert-withdrawn 4.9%, Withdrawn 0.7%, Denied 0.2%
Outcome breakdown
OutcomeShare
Certified94.3%
Cert-withdrawn4.9%
Withdrawn0.7%
Denied0.2%
Certified94.3%
Cert-withdrawn4.9%
Withdrawn0.7%
Denied0.2%

Outcomes — Qualcomm Incorporated

DOL case-status mix.

Outcome breakdown: Certified 67.3%, Cert-withdrawn 27.5%, Withdrawn 4.0%, Denied 1.1%
Outcome breakdown
OutcomeShare
Certified67.3%
Cert-withdrawn27.5%
Withdrawn4.0%
Denied1.1%
Certified67.3%
Cert-withdrawn27.5%
Withdrawn4.0%
Denied1.1%

Yearly filing volume

Year-over-year H-1B demand for each sponsor.

Microsoft Corporation
Time series: 17 points from FY2010 to FY2026
Time series
PeriodValue
FY20104,407
FY20114,184
FY20124,005
FY20133,832
FY20143,674
FY20154,476
FY20164,919
FY20174,884
FY20185,457
FY20196,000
FY202051
FY2021110
FY2022150
FY20232,791
FY20249,492
FY20259,362
FY20265,118
Qualcomm Incorporated
Time series: 17 points from FY2010 to FY2026
Time series
PeriodValue
FY20101,079
FY20111,217
FY20121,672
FY2013687
FY2014197
FY201592
FY201666
FY201759
FY201863
FY201958
FY20206
FY20210
FY202212
FY202338
FY202453
FY202584
FY202643

Top 5 occupations — Microsoft Corporation

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Replace either sponsor above without losing the comparison. 2-way for now; 3+ comparison coming soon.